AMD Ryzen 7000: X670 motherboard with two chipsets surfaced
An image has surfaced in China showing a dual-chipset Asus X670-P Prime WIFI. It is possible that the X670 is a combination of two identical chips, both of which are soldered separately on the PCB.
Recently, both Asrock and Gigabyte accidentally confirmed that the first AM5 motherboards with the X670(E) chipset will be presented at Computex. An image has now also been published in the Chinese Baidu forum that supposedly shows the PCB design of the Asus X670-P Prime WIFI.
X670 with two chips
The contact surfaces visible in the picture speak for a power supply with 14 phases, four RAM banks and a PCI Express X16 slot. There are also three other, shorter PCI-E slots and two M.2 slots. The features of the Asus X670-P Prime WIFI don’t sound too exciting at first, but there are apparently two chipsets on the mainboard.
In the published image, two BGA contact surfaces surrounded by additional components and corresponding holes for coolers can be clearly seen on the lower half. If the picture is real, the new Asus mainboard will not only rely on a chipset on the bottom right, but also on one directly under the PCI Express x16 slot. Assuming this is the standard configuration for the X670, that would put an end to older rumors that the X670 is a chiplet design. Instead, AMD would simply install the same chip twice on the PCB without an interposer.
Matching the topic: AMD: Lisa Su with Ryzen 7000 teaser, X670(E) from Asrock and Gigabyte confirmed
At least the basic approach of chiplets, to install the identical chip several times if necessary, could still be used in the X670. It would be conceivable, for example, that the upcoming B650 chipset simply relies on one of the corresponding chips, and the development of your own design for the X670 is avoided by installing two chips. AMD will probably have to clarify whether this is really the case. There should be more details on this next week at Computex.
Source: via Videocardz